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Tuttle Capital Memory Stack Income Blast ETF

23.16

+0.12550.54%

Post-market: 23.14-0.0203-0.09%17:32 EDT

Volume:5K

Turnover:117.36K

Market Cap:6.72M

PE:- -

High:23.37

Open:23.33

Low:22.99

Close:23.03

52wk High:34.00

52wk Low:17.26

Shares:290.00K

Float Shares:290.00K

Volume Ratio:1.49

T/O Rate:1.75%

Dividend:2.27

Dividend Rate:9.80%

ROE:--

ROA:--

PB:--

PE(LYR):- -

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Overview Company News Filings

HBM Holdings Clarifies Board Composition and Governance Structure

HBM Holdings Boosts Revenue and Advances Biologics Pipeline Amid Higher R&D Spend

Surge in Memory Chip Stocks: Net Profit Soars 2,207%

AI Demand Surge Sparks Rally in Memory Chip and Optical Communication Stocks

惠普2026财年Q3电话会深度解析：AI PC渗透率迈向70%，存储成本压力下利润率修复路径明确

Tech, Media & Telecom Roundup: Market Talk

ETF Market Alert | CSOP Leveraged Samsung (07747) Surges Over 4% as Samsung Unveils Three-Phase HBM Roadmap

Market Close Summary | Major Indices Surge Over 1% with Computing Hardware and Storage Chips Leading Gains

Market Chatter: Kioxia to Build 1 Trillion Yen NAND Flash Memory Production Facility in Northern Japan; Shares Up 5%

MT Newswires Live

CXMT Growth Outlook Brightens Amid Tight Memory Market

Is YMTC Poised to Follow in CXMT's Footsteps as the Next Memory Giant?

Glass Substrates Poised as Key Next-Gen Advanced Packaging Platform, Core Equipment Segments May Reap Initial Gains

Memory Prices Set to Account for Bigger Share of AI Infrastructure Budgets

Is HBM Holdings (SEHK:2142) Fully Valued After Its HBM7004 IND Approval?

Simply Wall St.

330亿融资目标：长江存储冲刺科创板最大IPO，65岁半导体元老陈南翔的关键布局

Washington Pressures Seoul to Expand Memory Chip Manufacturing in the US

How Micron is Fighting Off Another China Threat

Chinese Chipmaker YMTC Seeks $4.9B IPO on AI-Driven Growth

Goldman Sachs Lifts Global Fab Equipment Spending Forecasts Sharply, With Memory and Advanced Foundry Leading the Charge

HBM Holdings to Join Hang Seng Composite Index

MT Newswires Live

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The firm has begun approaching equipment suppliers and may receive subsidies from Japan's Ministry of Economy, Trade and Industry as well, it said.The memory chip maker did not immediately respond to MT Newswires' request for comment.Shares of Kioxia rose over 5% in recent trade.","market":"sg","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.mtnewswires.com/","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"mtnewswires_news","symbols":["BK4588","BGSX","MIC","MUD","MUG","MUYY","MUZ","DRAL","MULL","DRMY","DISK","RAM","RAMZ","DRAM","DRMP","MUU"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662786721","title":"CXMT Growth Outlook Brightens Amid Tight Memory Market","url":"https://stock-news.laohu8.com/highlight/detail?id=2662786721","media":"Dow Jones","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2662786721?lang=en_us&edition=fundamental","pubTime":"2026-08-27 10:09","pubTimestamp":1787796540,"startTime":"0","endTime":"0","summary":"0209 GMT - Chinese DRAM maker CXMT is expected to sustain rapid growth over the next several years, as strong artificial-intelligence-related demand keeps the global memory market tight, according to a Morgan Stanley report. The brokerage initiates coverage of CXMT with an overweight rating, forecasting revenue to grow at a 140% compound annual rate between 2025 and 2028, driven by capacity expansion, rising adoption of its memory chips and firm pricing. Morgan Stanley estimates CXMT's share of global DRAM bit shipments will rise to 15% by 2030 from 11% in 2026, while global DRAM supply is expected to remain constrained through 2027 despite industry expansion plans. 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Recently, the Shanghai Stock Exchange's official website showed that Yangtze Memory Technologies Co., Ltd.'s (YMTC) IPO application has been...","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"express","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["LU1316542783.SGD","LU2458330169.SGD","BK4527","LU0889566641.SGD","LU1366333091.USD","LU0096364046.USD","LU0256863902.USD","LU2360107168.USD","SGXZ51526630.SGD","XNTK","SGXZ81514606.USD","CGGO","LU0154236417.USD","MULL","LU1989764664.SGD","LU2471134879.HKD","FTXL","LU0642271901.SGD","LU1778281490.HKD","LU2471134523.USD","LU2211815571.USD","LU0056508442.USD","LU0943347566.SGD","FTEC","LU1267930730.SGD","MIC","MUD","LEGR","XLK","FAI","BK4566","LU1868837300.USD","CHPS","LU1861220033.SGD","LU1720051017.SGD","AIQ","LU0210536198.USD","USXF","LU2896262040.SGD","MUU","LU0082616367.USD","LU0792757196.USD","LU0203347892.USD","LU1551013425.SGD","LU2543165471.USD","BK4543","TTXU","AIS","LU2290526834.HKD","BK4141","SMU00main","LU1629891620.HKD","LU1868836757.USD","LU2458330243.SGD","LU2357627491.SGD","LU1674673428.USD","LU0683600562.USD","IETC","DRMP","LU2471134796.USD","LU2054465674.USD","LU2931357623.SGD","BAI","LU2286300806.USD","LU0417517546.SGD","EGGY","LU1914381329.SGD","IE00BK4W5M84.HKD","LU1989764748.USD","LU1868836591.USD","JGRO","LU0274383776.USD","LU0889565833.HKD","LU0109392836.USD","LU2023250330.USD","GB00BDT5M118.USD","LU1803068979.SGD","BOBP","LU0708995401.HKD","LU1267930813.SGD","MUG","BK4579","IE00B1XK9C88.USD","LU1280957306.USD","TRFK","LU0203345920.USD","EFIV","IPOS","LU0323591593.USD","CHAT","SGXZ99366536.SGD","WUGI","LU0320765059.SGD","LU1145028129.USD","MUYY","IE000M9KFDE8.USD","LU1551013342.USD","ARTY","LU2168564065.EUR","LU2213496289.HKD","SHOC","BK4532","BK4554","SMH","PSI","LU0256863811.USD","EMSF","BK4585","LU0640476718.USD","LU2048586759.USD","LU0081259029.USD","IE00BSNM7G36.USD","WLDR","DRAM","DRAL","LU2750360641.GBP","IE00B19Z3B42.SGD","LU0719512351.SGD","LU2102340556.USD","DRMY","IE00BKDWB100.SGD","RAMZ","LU1323610961.USD","LU0820561909.HKD","IE0034235303.USD","BK4575","PTF","DISK","LU2471134952.CNY","LU0109391861.USD","BK4512","LU1548497426.USD","IE00B5949003.HKD","LU0157215616.USD","LU1720051108.HKD","LU1861215975.USD","LU2357305700.SGD","LU0689472784.USD","LU2168564222.USD","AIFD","MU","IE00BK4W5L77.USD","LU2168564495.EUR","LU2756315318.SGD","IE0009356076.USD","LU0964807845.USD","MUZ","IE00B19Z3581.USD","LU0859254822.USD","SOXQ","LU2756315664.SGD","LU0672654240.SGD","VGT","CHPX","LU2168563687.JPY","LU0127658192.USD","SOXX","LU2750360997.AUD","LU0061475181.USD","SG9999001424.SGD","LU1852331112.SGD","FXL","LU2250418816.HKD","IE00B7SZLL34.SGD","IE0002270589.USD","LU0820561818.USD","BK4533","IE00BWXC8680.SGD","FDTX","LU2089985449.USD","LU1868836914.USD","LU2360106780.USD","BK4553","LU0820562030.AUD","LU0133085943.USD","LU0238689110.USD","IE00BJLML261.HKD","LU1868837136.USD","HBMX","LU1674673691.USD","LU2168564149.EUR","BK4588","LU2403377893.USD","RULE","IXN","BK4605","LU0787776722.HKD"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1175481850","title":"Glass Substrates Poised as Key Next-Gen Advanced Packaging Platform, Core Equipment Segments May Reap Initial Gains","url":"https://stock-news.laohu8.com/highlight/detail?id=1175481850","media":"Stock News","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1175481850?lang=en_us&edition=fundamental","pubTime":"2026-08-27 07:48","pubTimestamp":1787788099,"startTime":"0","endTime":"0","summary":"A new report from CICC highlights that as AI large-chip packaging dimensions continue to scale up, glass substrates are emerging as a vital material platform for next-generation advanced packaging,...","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["AMKX","BESIY","AMKL","BK4147","TCAI","HBMX","DRMP"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662765934","title":"Memory Prices Set to Account for Bigger Share of AI Infrastructure Budgets","url":"https://stock-news.laohu8.com/highlight/detail?id=2662765934","media":"Dow Jones","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2662765934?lang=en_us&edition=fundamental","pubTime":"2026-08-26 08:46","pubTimestamp":1787705160,"startTime":"0","endTime":"0","summary":"0046 GMT - Memory prices are set to absorb an even larger share of cloud providers' AI infrastructure budgets in 2027, with DRAM and NAND flash projected to account for 68% of total capital expenditure, up from 47% in 2026, according to research firm TrendForce. Server DRAM prices are expected to rise about 270% in 2026, while prices for enterprise storage products could jump 235%, extending gains that began in the second half of 2025. TrendForce says higher memory costs, particularly for high-bandwidth memory, could lead AI chip and server vendors to raise prices further, prompting cloud providers to either spend more or optimize system memory configurations to control costs.","market":"other","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://dowjonesnews.com/newdjn/logon.aspx?AL=N","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["DRAM","QTOC","RAM","RAMZ","MUZ","AIPO","MUU","MUD","MIC","MUG","VTHR","BK4588","ARTY","AGIX","MULL","MUYY","DISK","DRAL","DRMP","CHAT","DRMY"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662349759","title":"Is HBM Holdings (SEHK:2142) Fully Valued After Its HBM7004 IND 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Micron Technology is reaping the rewards of the memory-chip boom but Chinese companies are eager to get in on the action, meaning the pressure is on for Micron to 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Holdings to Join Hang Seng Composite Index","url":"https://stock-news.laohu8.com/highlight/detail?id=2661247019","media":"MT Newswires Live","labels":["corporation"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2661247019?lang=en_us&edition=fundamental","pubTime":"2026-08-24 11:28","pubTimestamp":1787542115,"startTime":"0","endTime":"0","summary":"HBM Holdings (HKG:2142) will be added to the Hang Seng Composite Index from Sept. 7, according to a Monday Hong Kong bourse filing.Its shares are also expected to meet the criteria to be traded through the Shanghai-Hong Kong Stock Connect and the Shenzhen-Hong Kong Stock 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