Shenzhen Intellifusion Technologies Seeks Up to 1 Billion Yuan from Bond Issuance
MT Newswires Live
Sep 24
Shenzhen Intellifusion Technologies (SHA:688343) plans to raise up to 1 billion yuan from the private issuance of science and technology innovation corporate bonds, according to a Thursday filing with the Shanghai bourse.
The bonds will have a 10-year term with a rate to be determined through book-building and will be listed in Shanghai, the artificial intelligence chip maker said.
Proceeds will help repay debt, boost working capital, fund equity investments, contributions, and other legal purposes.
Shares in Intellifusion fell 2% during afternoon trading on Thursday.
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